It can be used to solder specific parts of a PCB.It requires only a minimum level of monitoring.It is one of the most reliable soldering technique.It is most commonly used for assembling PCBs in mass production. The reflow soldering technique is ideal for soldering surface mount components. Besides, they require minimal monitoring, and the process is conducted in controlled conditions. Since they do not undergo any thermal shock, the joints are strong. The reflow soldering process produces reliable joints that are solid. In this, you apply the solder paste only over the areas (contact pads) where you want to assemble the electronic components. The board is passed through a tunnel or reflow oven where it is heated in a controlled manner. What is Reflow Soldering?Īs mentioned already, an infrared lamp is used to heat the air and melt the solder in the reflow soldering technique. The following article explains the process of reflow soldering, its pros, and the different stages involved in it. This can be prevented by using the reflow soldering technique. Thermal shock weakens the joints and causes them to break easily. So, you can heat the board gradually to ensure that it does not break due to thermal shock.Ī sudden rise in temperature is known as thermal shock. The lamp heats the air that melts the solder and joins the electrical components.īesides, you can control the temperature of the infrared lamp. The entire assembly is passed through a reflow oven that has an infrared lamp. But, the one major difference is that it uses heated air to melt the solder instead of a soldering iron. The reflow soldering technique resembles the traditional soldering process in many ways. Reflow soldering is a process in which solder paste is applied to the contact pads of a PCB and melted to join the electrical components.
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